Vertically integrated component assembly incorporating active and passive components
AssigneePacsetter, Inc.
InventorAlvin H. Weinberg
Life of this patent
Estimating the term…
Abstract
An vertically-integrated electronic assembly containing integral passive components is combined with an integrated circuit creating a three-dimensional package. The electronic assembly is formed as a multi-layered structure having deposited passive components on a substrate layer. Contact pads for the passive components extend to an edge of the substrate layer and are exposed for contact with surrounding circuitry and with the combined integrated circuit.
Claims21
An apparatus for combining an integrated circuit device with passive components comprising:
- a conductive layer forming a first ground plane;
- a substrate layer juxtaposed with the conductive layer, the substrate layer having contact pads and passive component material printed in a desired pattern between the contact pads so that a plurality of passive components are formed thereon, the contact pads having fingers extending substantially to an edge of the substrate layer;
- a dielectric layer juxtaposed with the substrate layer for insulating the passive components;
- and
- a second conductive layer juxtaposed with the dielectric layer and forming a second ground plane, the second ground plane being electrically connected to the first ground plane and electrically insulated from the plurality of passive components, the second conductive layer providing a mounting surface for the integrated circuit device.
A three-dimensional microelectronic integrated circuit package comprising:
- an integrated circuit including a bottom surface having a first periphery;
- a component assembly formed with passive-circuit components and having a mounting surface for mounting the bottom surface of the integrated circuit thereon, the mounting surface having a second periphery sized such that the first periphery of the integrated circuit is substantially contiguous with the second periphery, the component assembly comprising:
- a ceramic substrate having the passive-circuit components printed on a first planar surface of the substrate, the passive components having connection terminals extending to an edge of the first planar surface for establishing electrical communication with the integrated circuit;
- a layer of dielectric material placed over the passive components such that the connection terminals are exposed;
- conductive means, placed over the layer of dielectric material, for providing the mounting surface for the integrated circuit device, the conductive means further including means for electrically connecting the bottom surface of the integrated circuit with a bottom surface of the component assembly.
A three-dimensional electronic package combining an integrated circuit with passive electronic components for incorporation into a main substrate board of a cardiac stimulation device comprising:
- a substrate layer having a plurality of passive circuit components formed on a first surface of the substrate layer, the passive components having electrical fingers extending to an edge of the substrate layer;
- a first metallic pad defining a first outer boundary, the first metallic pad being printed on the second surface of the substrate layer with the first outer boundary substantially within the confines of the substrate layer;
- a dielectric layer printed on the first surface of the substrate layer for insulating the passive components, the dielectric layer defining a second outer boundary smaller than the first outer boundary to expose the electrical fingers;
- a second metallic pad printed on the dielectric layer and substantially within the second outer boundary, the second metallic pad in electrical communication with the first metallic pad;
- and
- an integrated circuit mounted on the second metallic pad and substantially within the second outer boundary, the integrated circuit having electrical contact pads proximate the electrical fingers enabling interconnection between the contact pads and the fingers.
Dependencies are inferred from the claim text.