US 5,670,802 AGranted

Semiconductor device

AssigneeNEC Corporation

InventorTsuneo Koike

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Abstract

The invention provides a semiconductor device in the form of an LSI circuit having a large number of terminals wherein an increase of the number of pad terminals for a power source potential and wherein a ground potential does not increase the inductances of wiring lines to the pad terminals and the terminals are arranged efficiently. The semiconductor device includes a semiconductor chip having a semiconductor substrate on which a first pad arrangement region, a buffer arrangement region and a second pad arrangement region are successively assured in this order toward the outer side around an internal circuit formation region and arranged in parallel to each other. A first power source pad and a first grounding pad for an internal circuit are provided in the first pad arrangement region while a plurality of pads for inputting and/or outputting signals are provided in the second pad region. The pads are bonding connected by respective thin metal lines to external lead terminals provided on a support.

Claims5

Dependent claims

A semiconductor device, comprising:

a semiconductor chip having an internal circuit formed in an internal circuit formation region on a semiconductor substrate of said semiconductor chip;
a support having external lead terminals and having said semiconductor chip supported thereon;
said semiconductor substrate further comprising a first pad arrangement region, a buffer arrangement region and a second pad arrangement region successively arranged towards an outer edge of said internal circuit formation region;
a power source wiring line and a grounding wiring line for an input/output buffer in said buffer arrangement region arranged in said buffer arrangement region;
a first power source pad and a first grounding pad for said internal circuit provided in said first pad arrangement region;
and
a plurality of pads provided in said second pad arrangement region for inputting and outputting signals;
said first power source pad and said first grounding pad each being connected to a respective one of said external lead terminals by at least one thin metal line which passes over said buffer arrangement region.

5 more elements

Dependencies are inferred from the claim text.