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US 5,670,750 AGranted
Electric circuit card having a donut shaped land
AssigneeInternational Business Machines Corporation
InventorsJohn Matthew Lauffer, David John Russell, James Jens Hansen
Life of this patent
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Abstract
A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.
Claims10
A multi-layer electronic circuit package, comprising:
- substrate means formed of a predetermined metal with high thermal conductivity properties;
- a relatively thin, curable dielectric material formed as a layer on at least one surface of said substrate means to provide electrical insulation characteristics of a predetermined magnitude;
- an electrically conductive layer of a predetermined copper material in a predetermined circuit pattern formed on said dielectric material;
- at least one electrical interconnection by a donut configured land providing a via through which the dielectric material is dissolved to form a via opening;
- and
- electrical connections between predetermined layers of said multi-layer package formed of a preselected reflowed solder paste.
3 more elements
An interconnect assembly, comprising:
- a metal plate;
- a layer of a curable dielectric in direct contact with a surface of the metal plate with an interface structure indicating that the dielectric was cured in contact with the metal surface;
- a wiring layer on a surface of the dielectric including lands of which a plurality are donut shaped, and conductors connected to a plurality of the lands;
- a plurality of via holes extending through the cured dielectric each from a respective donut shaped land to the metal plate;
- a conductive material in the holes to electrically interconnect the lands to the plate;
- and
- components with leads connected to a plurality of the donut shaped lands interconnected to the plate, and to other lands of the wiring layer.
4 more elements
Dependencies are inferred from the claim text.