Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area

A substrate, comprising:

• a first circuit board layer having a mounting area for receiving an electrical device, the first circuit board layer including at least one conductive insert member at the mounting area;
• a second circuit board layer being attached to the first circuit board layer, the second circuit board layer being configured so that the mounting area is exposed, wherein the first circuit board layer is comprised of an insulated frame member for holding the at least one conductive insert member, an insulative layer, and a conductive layer, the insulative layer being disposed between the insulative frame and the conductive layer.

A multilayer circuit board including at least one enhanced metal layer and at least one circuit board layer, the multilayer circuit board having a board top side and a board bottom side, the improvement comprising:

• an exposed area of the enhanced metal layer on the board top side of the multilayer circuit board, wherein the enhanced metal layer has a first top side and a first bottom side, and the at least one circuit board layer has a second top side and a second bottom side, the second bottom side of the circuit board layer being attached to the first top side of the enhanced metal layer, wherein the enhanced metal layer includes a thick solid conductive medium from the first top side to the first bottom side, and wherein the at least One enhancement metal layer is comprised of an insulative frame holding at least one copper slug.

A multilayer circuit board including at least one enhanced metal layer and at least one circuit board layer, the multilayer circuit board having a board top side and a board bottom side, the improvement comprising:

• an exposed area of the enhanced metal layer on the board top side of the multilayer circuit board, wherein the enhanced metal layer has a first top side and a first bottom side, and the at least one circuit board layer has a second top side and a second bottom side, the second bottom side of the circuit board layer being attached to the first top side of the enhanced metal layer, wherein the at least one enhanced metal layer is comprised of an insulative frame holding at least one copper slug.

A circuit board upon which a semiconductor device is mounted, the circuit board comprising:

• a mounting circuit board layer having an enhanced conductive member for supporting the semiconductor device, the enhanced conductive member being a thick, solid conductive material;
• and
• at least one additional circuit board layer coupled to the mounting circuit board layer, the at least one additional circuit board layer having a window over a portion of the conductive member, and wherein the mounting circuit board layer includes a frame configured to support the at least one conductive member.

A circuit board upon which a semiconductor device is mounted, the circuit board comprising:

• a mounting circuit board layer having an enhanced conductive member for supporting the semiconductor device and at least one additional circuit board layer coupled to the mounting circuit board layer, the at least one additional circuit board layer having a window over a portion of the conductive member, wherein the mounting circuit board layer includes an insulative frame for holding the enhanced conductive member, an insulative layer, and a conductive plane, the insulative layer being located between the insulative frame and the conductive plane.