Process of conveying an encapsulated electronic component by engaging an integral resin projection
AssigneeRohm Co., Ltd.
InventorTomohiro Murayama
Life of this patent
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Abstract
A process for manufacturing an encapsulated electronic part having a resin body and an inwardly tapered projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body, The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.
Claims5
A method of manufacturing an electronic circuit comprising:
- providing an encapsulated electronic component by forming a resin body having an external top surface and containing an electronic component having exposed leads and having a projection in the form of a resin bar integral with and projecting substantially perpendicularly away from the resin body, the resin bar being tapered inwardly toward a joint at which it is attached to the external top surface of the resin body;
- holding the encapsulated electronic component with a holding device engaging the projection;
- and
- conveying the encapsulated electronic component to a position by moving the holding device.
Dependencies are inferred from the claim text.