Printing wiring board(s) having polyimidebenzoxazole dielectric layer(s) and the manufacture thereof
AssigneeThe Dow Chemical Company
InventorDavid A. Dalman
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Abstract
A film of polyimidebenzoxazole (PIBO) having an electrically conductive layer adhered to at least one face thereto, wherein the PIBO film has a tensile strength greater than 200 MPa. A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a PIBO film. A printed wiring board (PWB) having at least one polyimidebenzoxazole (PIBO) dielectric layer wherein the PWB has at least one thin dielectric base material layer, at least one thin conductor, at least one narrow conductor width and at least one small diameter via.
Claims33
A polyimidebenzoxazole (PIBO) film having an electrically conductive layer adhered to at least one face thereto wherein the PIBO film has a tensile strength greater than about 200 MPa at 25.degree. C. and an elastic modulus greater than about 0.5 GPa at about 25.degree. C.
A printed wiring board having at least one dielectric layer and at least one circuitry layer wherein at least one dielectric layer is a polyimidebenzoxazole (PIBO) film having a tensile strength of at least 200 MPa at 25.degree. C. and said printed wiring board passes thermal cycling test IPC 650 2.6.6B.
Dependencies are inferred from the claim text.