Process for potting components in an impregnating compound

Method of potting and subsequent curing of one or a plurality of components with an impregnating composition which does not cure at room temperature, but cures within less than 30 minutes at a temperature above 60.degree. C., comprising the steps of:

• a) Introducing a component or a pallet of a plurality of components into a potting chamber,
• b) Evacuating the potting chamber,
• c) Potting said component or plurality of components in the composition under vacuum,
• d) Venting the potting chamber,
• e) Removing said component or plurality of components and placing them in an airlock forechamber of a curing oven having an airlock forechamber, a main chamber and an airlock exit chamber,
• f) Closing the curing oven airlock forechamber and evacuating it,
• g) Opening said airlock forechamber to the oven main chamber, introducing the component or plurality of components into said main chamber, and then closing said main chamber,
• h) Passing the component or plurality of components through the oven main chamber,
• i) Opening the oven main chamber to the oven airlock exit chamber and passing the component or plurality of components out of the oven main chamber into the oven airlock exit chamber and closing the oven airlock exit chamber,
• j) Venting the oven airlock exit chamber and removing the component or plurality of components from the oven airlock exit chamber.