Reciprocating anode electrolytic plating apparatus and method

A plating system for plating a substrate in an electrolyte, comprising:

• a tank;
• a substrate fixture suspended in the tank capable of receiving the substrate, the substrate fixture having a perimeter surface portion and an inner surface portion;
• an electrical contact assembly carried on the substrate fixture for supplying electrical current to the perimeter surface portion of the substrate fixture;
• a first motor coupled to the substrate fixture for imparting rotary or translational movement to the substrate fixture during plating;
• an anode suspended in the tank;
• and
• a second motor coupled to the anode for imparting rotary or translational movement to the anode during plating;
• wherein, the first and second motors are operable to increase exposure of the anode to the inner surface portion of the substrate fixture relative to the perimeter surface portion of the substrate fixture.

A plating system for plating a substrate in an electrolytic bath, comprising:

• a substrate fixture for mounting and supplying electrical current to the substrate;
• an anode assembly for mounting and supplying electrical current to an anode;
• rotary means for rotating one of the substrate fixture and anode assembly about a first axis;
• translation means for translating the other of the substrate fixture and anode assembly transversely to the axis of rotation;
• and
• control means for controlling the speed of rotation relative to the speed of translation to increase uniformity of plating on the substrate.

A plating system for plating a substrate in an electrolytic bath, comprising:

• a substrate fixture for mounting and supplying electrical current to the substrate;
• means for rotating the substrate fixture about a first axis;
• an anode assembly for mounting and supplying electrical current to an anode;
• means for moving the anode assembly transversely relative to the rotating substrate fixture;
• and
• control means for controlling the speed of movement of the anode assembly relative to the speed of rotation of the substrate fixture to increase uniformity of plating on the substrate.

A method for electrolytic plating of a substrate in an electrolytic bath, comprising the steps of:

• mounting the substrate on a substrate fixture suspended within the electrolytic bath, with the substrate being oriented in spaced disposition relative to an anode also suspended within the electrolytic bath;
• rotating one of the substrate fixture and anode about a first axis of rotation;
• and
• translating the other of the substrate fixture and anode transversely relative to the axis of rotation during plating.