Apparatus and method for polishing workpiece
AssigneeEbara Corporation
InventorsTetsuji Togawa, Norio Kimura
Life of this patent
Estimating the term…
Abstract
A workpiece such as a semiconductor wafer is polished to a flat mirror finish. The workpiece is held by a top ring, and a lower surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, an upper surface of the semiconductor wafer is prevented from being etched by supplying a neutralizer between the upper surface of the semiconductor wafer and the holding surface of the top ring.
Claims9
An apparatus for polishing a lower surface of a workpiece, said apparatus comprising:
- a turntable with an abrasive cloth mounted on an upper surface thereof;
- a top ring disposed above said turntable and having a holding surface for holding a workpiece to be polished and pressing the workpiece against said abrasive cloth;
- a nozzle for supplying an abrasive solution onto said abrasive cloth;
- a plurality of openings formed in said top ring and being open at said holding surface of said top ring;
- and
- a neutralizer supply source communicating with said openings of said top ring for supplying a neutralizer between an upper surface of the workpiece and said holding surface of said top ring to prevent the upper surface of the workpiece from being etched by said abrasive solution.
An apparatus for polishing a lower surface of a workpiece, said apparatus comprising:
- a turntable with an abrasive cloth mounted on an upper surface thereof;
- a top ring disposed above said turntable and having a holding surface for holding a workpiece to be polished and pressing the workpiece against said abrasive cloth;
- a nozzle for supplying an abrasive solution onto said abrasive cloth;
- a plurality of openings formed in said top ring and being open at said holding surface of said top ring;
- a pressurized liquid source communicating with said openings of said top ring for supplying a pressurized liquid to said openings of said top ring;
- a transferring device for receiving the workpiece from said top ring with a space between said holding surface of said top ring and an upper surface of the workpiece;
- at least one outlet for directing cleaning liquid into said space to simultaneously clean said holding surface of said top ring and the upper surface of the workpiece;
- and
- said top ring and said transferring device being relatively movable to enable creation of said space sufficient to enable said simultaneous cleaning to be carried out.
A method for polishing a lower surface of a workpiece, said method comprising the steps of:
- holding a workpiece by a holding surface of a top ring;
- polishing the lower surface of the workpiece by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto said abrasive cloth;
- and
- supplying a neutralizer from openings of said top ring between an upper surface of the workpiece and said holding surface of said top ring to prevent said upper surface of the workpiece from being etched by said abrasive solution.
Dependencies are inferred from the claim text.