Assembly technique for an image sensor array
AssigneeEastman Kodak Company
InventorsTerry Tarn, Thomas G. Bailey
Life of this patent
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Abstract
A package design and a method of assembling an array of CCD image devices on a substrate to provide an assembly with an optically flat surface. A tolerance of approximately between 2 and 3 microns is achieved by a process requiring less finishing of the substrates used by conventional processes. The assembly package can be used to bond an array of image sensors on a substrate having less than optimum flatness while still maintaining the optical surfaces of the image sensors within a single focal plane.
Claims8
An improved method of placing an array of CCD image sensors on a substrate to maintain a single focal plane among the CCD image sensors comprising the steps of:
- providing a substrate having interface means for transmitting signals from at least one of the CCD image sensors;
- creating a template having at least one cutout for relative positioning of the CCD image sensors in a compatible manner upon the substrate such that the CCD image sensors are within a single plane;
- providing a base having a predetermined degree of flatness to allow the sensors to exist within a single focal plane, and having at least one aperture within the base at points coinciding with the cutouts within the template;
- attaching vacuum means to the aperture(s) for securing the CCD image sensors to the base;
- placing the CCD image sensors within the cutouts in the template and turning the vacuum means on to secure placement of the sensors;
- removing the template;
- applying an adhesive to a side of the CCD image sensors opposite the aperture(s), the adhesive having a predetermined thickness that is determined by tolerances of the substrate flatness, the predetermined thickness being used to compensate for lack of flatness within the substrate;
- and
- engaging the substrate with the base in a predetermined manner.
Dependencies are inferred from the claim text.