Stencil apparatus for applying solder paste
AssigneeMPM Corporation
InventorsRobert J. Balog, David P. Prince
Life of this patent
Estimating the term…
Abstract
A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.
Claims25
A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil comprising
- a sheet having holes therethrough in a pattern corresponding to said desired pattern, a smooth upper surface for receiving said solder paste thereon, and a lower surface for contacting said surface of said circuit board,
- said upper surface having relieved portions so as to increase the friction between said upper surface and said solder paste being squeegeed thereover.
Apparatus for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said apparatus comprising
- a stencil including a sheet having holes therethrough in a pattern corresponding to said desired pattern, a smooth upper surface for receiving said solder paste thereon and a smooth lower surface for contacting said surface of said circuit board, said upper surface having relieved portions so as to increase the friction between said upper surface and said solder paste being squeegeed thereover,
- a support for said stencil, and
- a squeegee blade movably mounted with respect to said support for moving along a squeegee stroke axis across said upper surface and squeegeeing solder thereover.
Dependencies are inferred from the claim text.