Spring retainer and alignment method
AssigneeMotorola, Inc.
InventorsLester Ticey, Peter Schneider, Jim Leonhardt
Life of this patent
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Abstract
A method for maintaining alignment of a stack of spring washers mounted on a shaft. A retainer (44) is provided with an opening (41) for mounting on a shaft (49), a planar surface (42) for contacting outer contact edge (46) of spring washer (47) and a retaining lip (43) for limiting the lateral movement of spring washer (47).
Claims17
An injection molding apparatus for forming an integrated circuit package, comprising:
- a shaft;
- a first spring washer having an outer contact edge and an opening for moving along the shaft;
- and
- a retainer having an opening less in diameter than the opening of the first spring washer for slidably mounting on the shaft, wherein the first spring washer is disposed on a first planar surface of the retainer extending from the opening of the retainer to a first retaining lip, the first retaining lip is greater in diameter than the outer contact edge of the first spring washer when the first spring washer is uncompressed, and the first retaining lip restricts movement of the first spring washer on the first planar surface to avoid contact between the first spring washer and the shaft.
An injection molding apparatus for compacting a moldable material to form an integrated circuit package, comprising:
- a shaft;
- a spring washer having an outer contact edge and an opening for moving along the shaft;
- a retainer having an opening less in diameter than the opening of the spring washer for slidably mounting on the shaft, wherein the spring washer is disposed on a planar surface of the retainer extending from the opening of the retainer to a retaining lip, the retaining lip is greater in diameter than the outer contact edge of the spring washer when the spring washer is uncompressed, and the retaining lip restricts movement of the spring washer on the planar surface to avoid contact between the spring washer and the shaft;
- and
- a mold sleeve for receiving the moldable material.
A method of forming an integrated circuit package, comprising the steps of:
- slidably mounting a spring washer along a shaft through an opening in the spring washer;
- disposing the spring washer against a retainer, the retainer having an opening less in diameter than the opening in the spring washer for slidably mounting on the shaft, wherein the spring washer is disposed on a planar surface of the retainer extending from the opening of the retainer to a retaining lip, the retaining lip is greater in diameter than the outer edge of the spring washer when the spring washer is uncompressed, and the retaining lid restricts movement of the spring washer on the planar surface to avoid contact between the spring washer and the shaft.
Dependencies are inferred from the claim text.