Method of making electronic package assembly with protective encapsulant material

A method of making an electronic package assembly, said method comprising:

• providing an organic substrate including a surface thereon having a plurality of electrical conductors positioned on said surface;
• positioning an electronic package having an elongated, electrically insulative housing including first and second pairs of opposing sides and first and second pluralities of electrically conductive leads projecting from the opposing sides of said first pair of said opposing sides, respectively, such that said housing is located on or above said surface of said substrate and said conductive leads are electrically connected to respective ones of said electrical conductors on said surface of said substrate, said second pair of said opposing sides not having electrically conductive leads projecting therefrom;
• substantially covering each of said conductive leads and at least a portion of a respective electrical conductor with a quantity of solder, said solder providing an electrical connection between said lead and respective conductor;
• and
• positioning a quantity of encapsulant material on said surface of said organic substrate and on said opposing sides of said second of said pairs of opposing sides of said insulative housing, said encapsulant material not being positioned on said conductive leads or said opposing sides of said first pair of said opposing sides, said encapsulant material substantially preventing electrical disconnection between said projecting conductive leads and said solder during operation of said electronic package assembly, said disconnection caused by stresses occurring due to differences in the coefficient of thermal expansion of said organic substrate, solder and conductive operation.