Method of making high input/output density MLC flat pack

A method for making a flat pack electronic component which comprises a multilayer ceramic substrate having electrical conductors in the substrate, a chip secured to the substrate and a plurality of input/output pads on at least one surface of the substrate at the periphery of said substrate with sites on the chip and the pads being electrically connected by the electrical conductors, the method comprising:

• forming an individual layer of unfired green ceramic;
• forming top to bottom electrical interconnection via paths in the ceramic;
• metallizing the vias;
• forming planar conductor lines on the ceramic layer;
• repeating the above steps for the number of individual ceramic layers desired;
• laminating the layers to form the multilayer ceramic substrate in which individual conductor lines on one or more layers are connected with one or more vias in the multilayer ceramic substrate to form individual interconnection circuits within the substrate;
• securing a chip to the substrate;
• electrically connecting a site on the chip to its corresponding pad on the multilayer ceramic substrate surface by electrically connecting one end of an individual interconnection circuit to the site on the chip and the other end of the individual interconnection circuit to its corresponding pad;
• and
• wherein the pads of the flat pack are electrically connected to an outside device by conductor leads from the outside device.