System and method for providing uniform solder jiunt height for printed circuit boards and their assemblies

A printed circuit board assembly which is installed through the use of a grounding fastener, comprising:

• an elongated aperture in the board for receiving the grounding fastener;
• a first conductive pad for connecting electrically to the grounding fastener;
• a plurality of via holes extending through the circuit board;
• a first solder mask provided as one layer of the circuit board, wherein the solder mask includes a plurality of small circular openings having a diameter of approximately 0.060" for exposing the underlying first conductive pad and wherein the first solder mask is positioned at the bottom layer of the printed circuit board, and wherein the plurality of small circular openings in the solder mask are aligned with the via holes;
• a second solder mask positioned as the top layer of the printed circuit board;
• and
• a second conductive pad for electrically connecting to said grounding fastener;
• wherein said first conductive pad connects to a bottom portion of said hook, and said second conductive pad connects to a top portion of said hook;
• and
• wherein said second solder mask includes an opening for exposing a narrow strip of said second conductive pad.

A PC board on which surface mounted components are placed;

• said PC board comprising:
• relatively large conductive pad areas on said PC board upon which the surface mounted components are located;
• a solder mask positioned over said conductive pad areas to minimize the amount of pad area that is exposed;
• wherein the pad area is partially circular and partially rectangular;
• and
• wherein said solder mask includes a plurality of small circular openings exposing said conductive pad area, the small circular openings having a diameter of approximately of 0.060" and being arranged in a polka dot pattern around said rectangular portion.