Semiconductor device having shielding structure made of electrically conductive paste
AssigneeNEC Corporation
InventorHidenori Egawa
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Abstract
Disclosed herein is a semiconductor device having shielded structure of an integrated circuit for improving the noise shielding characteristic. The semiconductor device comprises a wiring substrate 100, a recess 101 formed on one main surface of the wiring substrate 100, an IC chip 12 mounted on the recess 101, a resin 13 formed to cover the IC chip 12 and fill the recess 101, a conductive paste 14 formed on the resin 13, a GND pattern 18 formed on the other main surface of the wiring substrate 100, and a through hole 15 formed in the wiring substrate 100 for connecting the GND pattern 18 to the conductive paste 14 electrically.
Claims12
A semiconductor device comprising:
- a wiring substrate having a recess formed on a first main surface of said wiring substrate;
- a first conductive pattern formed on said first main surface, and having a fixed potential;
- at least one element mounted on a bottom of said recess;
- a sealing resin formed to cover said element and fill said recess;
- and
- a conductive shielding pattern formed directly on and covering a surface area of said sealing resin covering said at least one element and electrically connected with said first conductive pattern.
Dependencies are inferred from the claim text.