Semiconductor device and production method thereof
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShunichi Abe, Seizo Ohmae
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Abstract
A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.
Claims1
A semiconductor device comprising:
- a semiconductor chip having opposed front and rear surfaces and a plurality of first electrodes disposed on the front surface of said semiconductor chip;
- and
- an insulating tape having opposed front and rear surfaces and comprising a plurality of second electrodes on the front surface of said insulating tape at locations respectively corresponding to locations of said first electrodes on said semiconductor chip, a plurality of electrodes for external connection on the rear surface of said insulating tape, and interconnections electrically connecting said respective second electrodes to corresponding first electrodes for external connection wherein said semiconductor chip is attached to said insulating tape such that said respective first electrodes are in electrical contact with corresponding second electrodes and wherein said insulating tape extends beyond said semiconductor chip to two opposed ends, said insulating tape includes three bends proximate to each end of said insulating tape forming a protrusion on each of two opposed sides of said semiconductor chip between said semiconductor chip and the respective opposed ends of said insulating tape, and said plurality of electrodes for external connection are located on the rear surface of said insulating tape at the respective ends of said insulating tape.
Dependencies are inferred from the claim text.