Photosensitive resin composition
AssigneeHitachi Chemical Company, Ltd.
InventorsHideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
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Abstract
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.
Claims9
A poly(amic acid) ester resin obtained by esterifying carboxyl groups of a poly(amic acid) resin having recurring units represented by the formula:
- ##STR42## wherein X is a monovalent photosensitive group;
- R.sub.1 is a (2+p)-valent organic group;
- R.sub.11 is a tetravalent organic group;
- R.sub.12 is a divalent organic group;
- p is an integer of 1 to 12;
- and m and n are molar numbers of recurring units, and m/n is 1/99 to 100/0, with a compound having no vinyl group, or obtained by subjecting a diamino compound of the formula:
- ##STR43## wherein X is a monovalent photosensitive group;
- R.sub.1 is a (2+p)-valent organic group;
- and p is an integer of 1 to 12, another diamino compound, if used, and a tetravalent carboxylic acid diester to a condensation reaction.
Dependencies are inferred from the claim text.