Method of producing a flip chip
AssigneeNEC Corporation
InventorsMichinobu Tanioka, Motoji Suzuki
Life of this patent
Estimating the term…
Abstract
A flux is applied to a circuit board on which solder is deposited beforehand. Then, the circuit board is subjected to reflow and then to rinsing. After the rinsing, an IC chip 1 having metal bumps on its electrodes, is mounted to the circuit board. Before the mounting, the chip 1 and circuit board are heated in an inactive gas atmosphere having a low oxygen concentration. At the time of mounting, the solder is melted at a temperature higher than its melting point so as to connect the chip 1 to the circuit board.
Claims24
A method of producing a flip chip, comprising the steps of:
- applying a flux to a circuit board to which solder is applied beforehand;
- causing the flux to reflow;
- rinsing the circuit board after the reflow;
- mounting an integrated circuit (IC) chip having metal bumps on electrodes thereof to the circuit board;
- melting the solder by heating the solder at a temperature higher than a melting point of the solder in an inactive atmosphere having an oxygen concentration;
- and
- maintaining said IC chip and said circuit board at a pressure for a time period.
A method of producing a flip chip, comprising the steps of:
- applying a flux to a circuit board to which solder is applied beforehand;
- causing the flux to reflow;
- rinsing the circuit board after the reflow;
- and
- melting, when an integrated circuit (IC) chip having metal bumps on electrodes thereof is mounted to the circuit board, the solder at a temperature higher than a melting point of the solder in an inactive atmosphere having an oxygen concentration, and
- maintaining said IC chip and said circuit board at a pressure for a time period.
A method of soldering an electronic part, comprising the steps of:
- applying a flux to a circuit board to which solder is applied beforehand;
- causing the flux to reflow;
- rinsing the circuit board after the reflow;
- mounting an electronic part having metal bumps on electrodes thereof to the circuit board;
- and
- melting the solder by heating the solder at a temperature higher than a melting point of the solder in an inactive atmosphere having an oxygen concentration.
Dependencies are inferred from the claim text.