Electrically conductive bonding films
AssigneeHitachi Chemical Company, Ltd.
InventorsMasami Yusa, Shinji Takeda, Takashi Masuko, Yasuo Miyadera, Mitsuo Yamazaki
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Abstract
An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.
Claims7
An electrically conductive bonding film consisting essentially of a self-supporting resin film, wherein the resin film is not sticky at room temperature, comprising:
- (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I):
- ##STR6## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine;
- and
- (B) 1-8,000 parts by weight of an electrically conductive filler per 100 parts by weight of the polyimide resin.
Dependencies are inferred from the claim text.