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US 5,667,851 AGranted
Process for preparing a metallized polymide film containing a hydrocarbyl tin compound
AssigneeE. I. Du Pont de Nemours and Company
InventorsJames R. Edman, Donald J. Coulman
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Abstract
A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.
Claims9
A process for preparing a metallized polyimide film, comprising the steps of:
- (a) incorporating a hydrocarbyl tin compound in oxidation states (II) or (IV) into a solution of a poly(amic acid) precursor of a polyimide film;
- (b) forming a solidified self-supporting film of said poly (amic acid) precursor;
- (c) heating said solidified poly(amic acid) film at a temperature greater than 350.degree. C. to completely imidize said poly(amic acid) to form said polyimide film, wherein the concentration of tin in said completely imidized polyimide film ranges from 0.05 to 0.50% by weight;
- (d) forming a vacuum deposited metal layer having a thickness of from 500 to 5000 angstroms by vacuum deposition of a metal on at least one side of said polyimide film;
- and
- (e) applying an electroplated layer having a thickness of from 10 to 70 micrometers onto said vacuum deposited metal layer, wherein said polyimide base layer is directly bonded to said vacuum deposited metal layer without the use of an adhesive.
3 more elements
Dependencies are inferred from the claim text.