Copper alloy sheet for connectors and connectors formed of same

Abstract

There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of: Mg: 0.3-2% by weight; P: 0.001-0.02% by weight; C: 0.0002-0.0013% by weight; O: 0.0002-0.001% by weight; and Cu and inevitable impurities: the balance. The copper alloy sheet has a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 .mu.m are evenly dispersed in a matrix of the copper alloy sheet. The copper alloy sheet is excellent not only in tensile strength, elongation, electric conductivity and spring limit value before forming, but also in spring limit value after forming, and high-temperature creep strength.

Dependencies are inferred from the claim text.