Polishing agent used for polishing silicon wafers and polishing method using the same
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsHisashi Masumura, Kiyoshi Suzuki
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Abstract
A polishing agent used for polishing a silicon wafer is composed of a colloidal silica polishing agent containing an ethyl silicate monomer and/or an ethyl silicate polymer. Even when the polishing agent is used with a rigid polishing pad, it is able to provide a polished wafer having an excellent flatness and whose surface has a roughness comparable to that obtained by the conventional final polishing process.
Claims6
A polishing agent composition for polishing a silicon wafer, comprising a colloidal silica polishing agent and ethyl silicate in an amount in the range of 0.1 to 10.0 percent by volume relative to the total amount of said polishing agent composition.
Dependencies are inferred from the claim text.