Process of producing a low TCR surge resistor using a nickel chromium alloy
AssigneeCTS Corporation
InventorCharles C. Y. Kuo
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Abstract
Base metal resistors based on a new approach to alloy formation of nickel and chromium metals are presented that are rugged and offer excellent stability. Fine particle size nickel and chromium powders together with fluxing agents are blended together in a preselected ratio with a glass fret and screening agent. The composition is subsequently printed and fired in a nitrogen furnace at approximately 900.degree. C. to 930.degree. C. These resistors are compatible with other prior art base metal conductors, resistors and dielectrics.
Claims7
A thick film resistor composition for firing upon a substrate, said resistor composition comprising
- a metal constituent, said metal constituent comprising 76% to 80% nickel powder, 16% to 20% fine chromium powder, and a balance metal fluxing means, said metal fluxing means simultaneously forming a low TCR alloy with said nickel powder and said chromium powder during said firing and also chemically bonding to said substrate.
- a glass frit, and
- a means for adjusting screening rheology.
A method of manufacturing a low TCR highly stable thick film resistor comprising the steps of:
- blending powders of nickel, chromium, and metal containing fluxing means together;
- ensuring the powders are all of average particle size less than 5 microns;
- applying said blended powders to a substrate;
- heating said substrate to a temperature of less than 1,000 degrees Centigrade;
- chemically bonding said metal containing fluxing means to said substrate.
Dependencies are inferred from the claim text.