Keyed end effector for CMP pad conditioner
AssigneeLSI Logic Corporation
InventorThomas G. Mallon
Life of this patent
Estimating the term…
Loading patent…
AssigneeLSI Logic Corporation
InventorThomas G. Mallon
Estimating the term…
A polishing pad conditioner has a grid with an abrasive surface for conditioning a polishing pad. Opposite the abrasive side of the grid, there is a back surface, having at least one key way, which extends at least partially into the back surface. A grid holder has a number of keys equal to the number of key ways in the back surface of the grid. The grid holder keys engage the grid key ways, thereby eliminating slippage between the grid and the grid holder. A mechanized arm is attached to the grid holder, and imparts a rotational and translational motion to the grid holder. A magnet may be used as an attachment means between the grid and the grid holder. The key ways of the grid and the keys of the grid holder may be arranged such that the grid holder can only receive the grid with the back surface of the grid facing the grid holder.
A conditioner for being rotated relative to, and for being applied to, a polishing pad to condition the polishing pad for chemical mechanical polishing of a semiconductor wafer, comprising:
A conditioner for conditioning a polishing pad comprising:
A conditioner for conditioning a polishing pad comprising:
Dependencies are inferred from the claim text.