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AssigneeResource Concepts, Inc.
InventorRay Chapman
Estimating the term…
Preferred processes to separate metallic and non-metallic constituent components of at least one electronic product are generally comprised of the following steps: (a) repeatedly crushing the at least one electronic product to create a plurality of crushed electronic components; (b) repeatedly screening the plurality of crushed electronic components to ensure that the plurality of crushed electronic components substantially conform to a specific size; and (c) separating the plurality of crushed electronic components after steps (a) and (b) into non-metallic constituent components and metallic constituent components by weight. In addition, before step (a), the at least one electronic product must be provided or otherwise transported to crushing machines to perform step (a). Likewise, the crushed electronic components must be transported from one crushing machine to another crushing machine and to the separating apparatus to perform step (c). At least three crushing machines are generally used, so that the at least one electronic product are generally crushed at least three times (and transported between the crushing machines). The crushed electronic products are also periodically screened, such as after each crushing step to limit the size of the crushed materials in the stream of crushed materials being evaluated. Lightweight material is also removed from the stream of crushed materials by at least one air separator. Portions of the light weight material that comprise metallic material are returned to the stream of crushed material. Portions of lightweight material substantially comprised of non-metallic materials (i.e., dust) is transported to a collection apparatus. The products can be shredded before step (a).
A process to isolate precious and semi-precious metals from at least one electronic circuit board, comprising the following steps:
A process to separate and isolate precious and semi-precious metals from at least one electronic circuit board, comprising the following steps:
A process to substantially isolate precious and semi-precious metals from at least one electronic circuit board, comprising the following steps:
A process to substantially separate and isolate precious and semi-precious metals from at least one electronic circuit board, comprising the following steps:
Dependencies are inferred from the claim text.