Module handling apparatus and method with rapid switchover capability

A handling and testing system for multiple chip modules (MCMs) comprising:

• a hopper into which a plurality of MCMs are loaded;
• a testing device;
• and
• a conveyance assembly which transports MCMs from the hopper to the testing device and then on to a subsequent station,
• wherein the conveyance assembly further comprises:
• a conveyor which provides movement of the MCMs,
• a side rail which provides support to a free edge of the MCMs,
• a bottom rail having a top surface,
• a guide rail having a bottom surface in contact with the bottom rail top surface, an upwardly extending wall, and an outwardly extending flange which forms a first channel defined by the top surface, the extending wall and the flange, such that a first MCM of a first thickness can pass laterally through the channel, the first MCM being in contact with the top surface to position contact nodes provided on the first MCM at a predetermined vertical position with respect to the top surface, and
• a removable justifying plate having an upper surface and a lower surface, both substantially parallel to the bottom rail top surface, removably attached in contact with the bottom rail top surface within the first channel, thereby forming a second channel defined by the upper surface, the extending wall and the flange, such that a second MCM of a second thickness which is less than the first thickness of the first MCM, can pass laterally through the channel, the second MCM being in contact with the upper surface of the removable justifying plate to position contact nodes provided on the second MCM at substantially the same predetermined position with respect to the top surface as the first MCM.

A method for switching between a first MCM of a first thickness and a second MCM of a second thickness, and back again, on an apparatus for handling MCMs where each MCM is conveyed within a channel created by a bottom rail and a guide rail with an overhanging guide flange such that the contact nodes on the MCM's printed circuit board are maintained at a predetermined vertical position with respect to a top surface of the bottom rail, comprising the steps of:

• setting up the handling apparatus for a first MCM of a first thickness;
• conveying the first MCM along the handling apparatus for testing and handling;
• removably attaching a removable justifying plate to the top surface of the bottom rail within the channel such that the removable justifying plate and the guide rail form a second channel through which a second MCM of a second thickness, which is less than the first thickness of the first MCM, can be conveyed with the contact nodes on the second MCM maintained at substantially the same predetermined vertical position with respect to the top surface of the bottom rail as that of the first MCM;
• and
• conveying a second MCM along the handling apparatus for testing and handling.