# US 5,666,721 A · Method of soldering an electronic connector on a printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,666,721 A - Document ID: US5666721A - Status: Granted - Kind: A - Application number: 08/373,785 - Filed: 1995-01-17 - Granted: 1997-09-16 - Earliest claimed: 1994-01-18 - Assignees: Matsushita Electric Industrial Co., Ltd. - Inventors: Shoji Sakemi - Web page: https://patentgrep.com/patent/US5666721A ## CPC - H01R 43/205: {with a panel or printed circuit board} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 3/3405: {Edge mounted components, e.g. terminals} - H01R 12/725: {containing contact members presenting a contact carrying strip, e.g. edge-like strip} - H05K 3/305: {Affixing by adhesive} - H05K 3/3426: {characterised by the leads} - H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) - H05K 2201/09381: Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component - H05K 2201/09663: Divided layout, i.e. conductors divided in two or more parts - H05K 2201/10189: Non-printed connector - H05K 2201/10772: Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering - H05K 2203/0545: Pattern for applying drops or paste; Applying a pattern made of drops or paste - H05K 2203/167: Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment - Y10T 29/49149: by metal fusion bonding - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the edge of the printed circuit board 10. The lead 20 is shifted along the surface of connector electrode 13 inwardly from the edge of the printed circuit board 10 until a distal end 20a of the lead 20 is brought into contact with the solder paste 26. Then, the solder paste 26 is melted under the condition where the distal end 20a is brought into contact with the solder paste 26, thereby soldering the connector 18 on the printed circuit board 10. ## Claims ### Claim 1 A method of soldering a connector on a printed circuit board, wherein said connector has a lead and a protrusion both extending from a main body of said connector in parallel to each other, and a connector electrode extends along a surface of the printed circuit board inwardly from an edge of the printed circuit board, said method comprising the steps of: applying solder onto the connector electrode, said solder being offset a predetermined distance inward from the edge of said printed circuit board; engaging said connector with said printed circuit board by sliding said lead along the connector electrode inwardly from the edge of the printed circuit board, while sandwiching said printed circuit board between said lead and said protrusion of said connector, until a distal end of said lead is brought into contact with said solder; and melting said solder which is brought into contact with said lead, thereby soldering the connector on the printed circuit board. ### Claim 2 (depends on 1) The connector soldering method in accordance with claim 1, wherein said distal end of the lead is bent to form a rising surface to be brought into contact with said solder. ### Claim 3 (depends on 1) The connector soldering method in accordance with claim 1, wherein a curvature is formed at an intermediate portion of said lead to define a space for filling solder between the lead and the connector electrode. ### Claim 4 A method of soldering a connector on a printed circuit board, wherein first and second leads protrude in parallel with each other from a main body of the connector and connector electrodes extend along front and reverse surfaces of the printed circuit board inwardly from an edge of the printed circuit board, said method comprising the steps of: coating solder on a surface of the connector electrode extending along the reverse surface of the printed circuit board; applying solder onto the connector electrode extending along the front surface, being offset a predetermined distance inward from the edge of the printed circuit board; sliding said first lead along a surface of the connector electrode on the front surface and said second lead along a surface of the solder coated on the connector electrode on the reverse surface inwardly from the edge of the printed circuit board until a distal end of said first lead is brought into contact with said solder applied onto the connector electrode on the front surface; and melting both said solder applied on the connector electrode on the front surface and said solder coated on the connector electrode on the reverse surface under a condition where said distal end of the first lead is brought into contact with said solder applied on the connector electrode on the front surface, thereby soldering the connector on both front and reverse surfaces of the printed circuit board. ### Claim 5 (depends on 4) The connector soldering method in accordance with claim 4, wherein said distal end of the first lead is bent to form a rising surface to be brought into contact with said solder applied on the connector electrode on the front surface. ### Claim 6 (depends on 4) The connector soldering method in accordance with claim 4, wherein a curvature is formed at an intermediate portion of said first lead to define a space for filling solder between the first lead and the connector electrode on the front surface. ### Claim 7 (depends on 4) The connector soldering method in accordance with claim 4, further comprises steps of: applying solder onto a surface of said connector electrode on the reverse surface before said connector is brought into contact with the printed circuit board; and melting said solder applied on the surface of said connector electrode on the reverse surface, thereby forming a solder coat on said connector electrode extending along the reverse surface. ### Claim 8 (depends on 4) The connector soldering method in accordance with claim 4, wherein said connector electrode extending along the reverse surface is bifurcated to form a slit for guiding said second lead in a predetermined direction from the edge of said printed circuit board. ### Claim 9 A method of soldering a connector on a printed circuit board, wherein said connector has a lead and a protrusion both extending from a main body of said connector in parallel to each other, and a connector electrode extends along a surface of the printed circuit board inwardly from an edge of the printed circuit board, said method comprising the steps of: applying solder onto the connector electrode, being offset a predetermined distance inward from the edge of the printed circuit board; applying solder onto surface mounting type electrodes, formed on the same surface as said connector electrode; placing a surface mounting type electronic component on said solder applied on said surface mounting type electrodes; engaging said connector with said printed circuit board by sliding said lead along the connector electrode inwardly from the edge of the printed circuit board, while sandwiching said printed circuit board between said lead and said protrusion of said connector, until a distal end of said lead is brought into contact with said solder on the connector electrode; and melting both said solder on the connector electrode and said solder on the surface mounting type electrodes under a condition where the distal end of the lead is brought into contact with said solder on the connector electrode, thereby soldering both the connector and the surface mounting type electronic component on the printed circuit board. ### Claim 10 (depends on 9) The connector soldering method in accordance with claim 9, wherein said distal end of the lead is bent to form a rising surface to be brought into contact with said solder on the connector electrode. ### Claim 11 (depends on 9) The connector soldering method in accordance with claim 9, wherein a curvature is formed at an intermediate portion of said lead to define a space for filling solder between the lead and the connector electrode. ### Claim 12 A method of soldering a connector on a printed circuit board, wherein first and second leads protrude in parallel with each other from a main body of the connector and connector electrodes extending along both surfaces of the printed circuit board inwardly from an edge of the printed circuit board, said method comprising the steps of: applying solder onto the connector electrode extending along one surface of the printed circuit board; applying solder onto surface mounting type electrodes formed on said one surface of the printed circuit board; placing a surface mounting type electronic component on the solder applied on the surface mounting type electrodes formed on said one surface of the printed circuit board; melting said solder applied on said one surface of the printed circuit board; applying solder onto the connector electrode formed on the other surface of said printed circuit board, being offset a predetermined distance inward from the edge of the printed circuit board; applying solder on surface mounting type electrodes formed on said other surface of the printed circuit board; placing another surface mounting type electronic component on the solder applied on the surface mounting type electrodes formed on said other surface of the printed circuit board; engaging said connector with said printed circuit board by sliding said first lead along a surface of the connector electrode on said other surface and sliding said second lead along a surface of the solder applied on the connector electrode on said one surface inwardly from the edge of the printed circuit board, while sandwiching said printed circuit board between said first and second leads, until a distal end of said first lead is brought into contact with said solder formed on said other surface; and melting the solder applied on said other surface of the printed circuit board, under a condition where the distal end of the first lead is brought into contact with said solder formed on the connector electrode on said other surface, thereby soldering the connector on both surfaces of the printed circuit board. ### Claim 13 (depends on 12) The connector soldering method in accordance with claim 12, wherein said distal end of the first lead is bent to form a rising surface to be brought into contact with the solder formed on the connector electrode on said the other surface. ### Claim 14 (depends on 12) The connector soldering method in accordance with claim 12, wherein a curvature is formed at an intermediate portion of said first lead to define a space for filling solder between the first lead and the connector electrode on said the other surface. ### Claim 15 (depends on 12) The connector soldering method in accordance with claim 12, wherein said connector electrode extending along said one surface is bifurcated to form a slit for guiding said second lead in a predetermined direction from the edge of said printed circuit board.