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AssigneesFujitsu Limited, Kyushu Fujitsu Elecronics Limited, Fujitsu Automation Limited
InventorsJunichi Kasai, Kazuto Tsuji, Norio Taniguchi, Takashi Mashiko, Masao Sakuma, Yukio Saigo, Yoshiyuki Yoneda, Masashi Takenaka
Estimating the term…
A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
A method of testing a semiconductor device which comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a substantially rectangular package encapsulating at least the inner leads and the semiconductor chip, wherein the outer leads extend outwardly from the package, said package having an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts due to the different sizes, each of said outer leads having a part which is exposed at the stepped part of the package, said method comprising the steps of:
A method of testing a semiconductor device which comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a substantially rectangular package encapsulating at least the inner leads and the semiconductor chip, wherein the outer leads extend outwardly from the package, said package having an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts due to the different sizes, each of said outer leads having a part which is exposed at the stepped part of the package, said method comprising the steps of:
A method of testing a semiconductor device which comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a substantially rectangular package encapsulating at least the inner leads and the semiconductor chip, wherein the outer leads extend outwardly from the package, said package having an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts due to the different sizes, each of said outer leads having a part which is exposed at the stepped part of the package, said method comprising the steps of:
Dependencies are inferred from the claim text.