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US 5,666,004 AGranted
Use of tantalum oxide capacitor on ceramic co-fired technology
AssigneeIntel Corporation
InventorsBidyut K. Bhattacharyya, Larry Mosley
Life of this patent
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Abstract
An electronic package which contains a tantalum oxide capacitor that couples a conductive bottom surface of an integrated circuit to a plurality of conductive lines within the housing of the package. The conductive lines are connected to pins which provide power and ground to the integrated circuit. The pins and conductive lines are also coupled to a number of junctions located on the top surface of the die, by a plurality of wires. The package couples both the top and bottom surfaces of the integrated circuit to the power and ground pins of the package.
Claims3
An integrated circuit package, comprising:
- a package that has a first outer surface and an opposite second outer surface, said package further containing a surface pad located on a bonding shelf and a center opening;
- a capacitor that is mounted to said first outer surface of said package;
- an integrated circuit that is mounted and electrically connected to said capacitor through said center opening of said package;
- and,
- a bond wire that couples said integrated circuit to said surface pad.
2 more elements
Dependencies are inferred from the claim text.