Back to results
US 5,666,003 AGranted
Packaged semiconductor device incorporating heat sink plate
AssigneeRohm Co., Ltd.
InventorsKazutaka Shibata, Sadahito Nishida
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device is provided which comprises a die pad, a semiconductor chip mounted on the die pad, a plurality of leads electrically connected to the semiconductor chip, a heat sink plate bonded to the die pad opposite to the semiconductor chip, and a resin package enclosing at least the semiconductor chip together with the die pad and a part of each lead. The heat sink plate has a peripheral portion partially overlapping each lead but electrically insulated.
Claims8
A packaged semiconductor device comprising:
- a die pad;
- a semiconductor chip mounted on the die pad;
- a plurality of leads electrically connected to the semiconductor chip;
- a heat sink plate bonded to the die pad opposite to the semiconductor chip, the heat sink plate having a peripheral portion partially overlapping each of the leads but electrically insulated therefrom;
- and
- a resin package enclosing at least the semiconductor chip together with the die pad and a part of each said lead;
- wherein the die pad has a contact surface for direct contact with the heat sink plate;
- wherein the heat sink plate is directly bonded to the die pad only in a limited central region without intervention of a separate bonding layer;
- and
- wherein the limited central region is smaller than said contact surface.
7 more elements
Dependencies are inferred from the claim text.