Microcavity capacitive device
AssigneeInternational Business Machines Corporation
InventorsMichael Steven Dusablon, Sr., Eric Jeffrey White
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Abstract
A method is presented for controlled formation of microcavities for various semiconductor and micro-machine applications. The method involves the steps of defining a void in a support structure, sealing the void with a resilient gas-permeable material such that a chamber is formed, diffusing gas into the chamber through the gas permeable material to create a pressurized chamber, and then allowing expansion of the pressurized chamber within the resilient material, thereby creating an enlarged cavity. The applications set forth include the production of large capacitors, field isolation structures, tubular sensors for chromatography, pressure sensors, and cooling channels for integrated circuits.
Claims5
A capacitive device comprising:
- a support structure having a void therein;
- a dielectric material disposed above said support structure and filling said void, said dielectric material having a cavity therein;
- a first metal plate disposed above said dielectric material near said cavity in said dielectric material;
- a second metal plate disposed within said cavity in said dielectric material;
- and
- a first electrical contact to said first metal plate and a second electrical contact to said second metal plate, wherein a capacitor is formed between said first metal plate and said second metal plate.
Dependencies are inferred from the claim text.