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AssigneeMitsui Toatsu Chemicals, Inc.
InventorsSyuji Tahara, Koichi Machida, Seiji Itami, Masayuki Horiuchi
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A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers. The said epoxy resin contains a polysulfide modified epoxy resin expressed in an amount of the general formula (1) by 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000 Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sub.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50. A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
A resin composition for sealing liquid crystal cells comprising an epoxy resin containing a polysulfide modified epoxy resin, a hydrazide compound, a urea compound as a cure accelerator in an amount of 0.2 to 5% by weight of the resin composition and filler, wherein the epoxy resin contains said polysulfide modified epoxy resin in an amount of 20 to 100% by weight, said hydrazide compound is present in an amount which provides a molar ratio of hydrazide groups to epoxy groups in the range of 1/3 to 2/3 moles of hydrazide groups per one mole of epoxy groups in the epoxy resin and said polysulfide modified epoxy resin is expressed by general formula (1):
Dependencies are inferred from the claim text.