Method for forming an electrical connection to a semiconductor die using loose lead wire bonding

A method for forming an electrical connection to a semiconductor die, said method comprising:

• wire bonding a metal wire to a bond pad of the die;
• severing the metal wire to form a loose lead attached to the bond pad and having a desired length;
• assembling the die in an electronic device with the loose lead extending therefrom;
• forming a peripheral seal around the die and over the loose lead;
• and
• bonding the loose lead to an electrical component located outside of the seal.

A method for forming an electrical connection to a semiconductor die, said method comprising:

• wire bonding a metal wire to a bond pad of the die;
• severing the metal wire to form a loose lead attached to the bond pad;
• mounting the die to a first surface of an electronic device;
• forming an electronic component on a second surface of the device;
• and
• bonding the loose lead to the electronic component.

A method for forming a field emission display package comprising:

• wire bonding a metal wire to a pad of a semiconductor die;
• severing the metal wire to form a loose lead attached to the pad;
• assembling the die within the field emission display package;
• and
• forming an electrical connection between the loose lead and an electrical component for the field emission display package.

A method for forming a field emission display package comprising:

• wire bonding a metal wire to a bond pad of a semiconductor die;
• severing the metal wire to form a loose lead attached to the bond pad;
• forming a first plate and a second plate;
• mounting the die between the first and second plates;
• forming a peripheral seal between the first and second plates and over the loose lead to form a sealed space for the die with the loose lead extending from the sealed space;
• and
• bonding the loose lead to an electrical component outside of the sealed space.