Method for encapsulating an electrochemical sensor
AssigneeUnifet Incorporated
InventorsRex O. Bare, Andy Scherer
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AssigneeUnifet Incorporated
InventorsRex O. Bare, Andy Scherer
Estimating the term…
An electrochemical sensor assembly which allows a solution to make contact with an active sensing area of a sensor, while constraining the solution such that the fluid does not contact the sensor electronics and a method for fabricating such a sensor assembly. A sensor assembly is fabricated in accordance with a simple process, including: fabricating a master pattern which matches the external profile of an epoxy shell which will encapsulate a substrate upon which the sensors are mounted; forming a flexible tool (or mold) which conforms to the general profile of the master pattern; placing sensors together with any other desired electronic circuitry on a substrate (such as a printed circuit board or a ceramic pad to form a "hybrid"); pressing a number of electrical contact points on the hybrid and the active sensing area of each sensor on the substrate into contact with flexible protrusions of the flexible tool; and potting the hybrid. Due to the fact that the protrusions from the flexible tool are in contact with the hybrid and structures thereon, a seal is formed to prevent potting material from contacting and covering the predetermined areas of the hybrid covered by the protrusions from the flexible tool.
A method for encapsulating an electrochemical sensor including the steps of:
A method for encapsulating an electrochemical sensor including the steps of
A method for encapsulating an electrochemical sensor including the steps of:.
A method for encapsulating an electrochemical sensor, including the steps of:
Dependencies are inferred from the claim text.