Method for manufacturing a semiconductor device wherein electrodes on a semiconductor chip are electrically connected to lead terminals by plating bonding

Abstract

According to a face-down-mounting semiconductor device wherein electrode pads on a semiconductor chip and lead terminals are electrically connected to each other by plating bonding, and a method of manufacturing the semiconductor device, a guide tool is placed on the surface of a semiconductor chip. The guide tool includes guide holes corresponding in position to electrode pads. Columnar lead terminals are inserted into the guide holes of the guide tool. In this state, the semiconductor chip is soaked in a plating solution, together with the guide tool, to execute plating bonding. Since, therefore, the lead terminals can be brought into reliable contact with the electrode pads, metal plating layers can be grown sufficiently between them, thereby improving in reliability of melting bonding.

Dependencies are inferred from the claim text.