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US 5,665,651 AGranted
Process for encapsulating a semiconductor device and lead frame
AssigneeKabushiki Kaisha Toshiba
InventorsJunichi Asada, Masahiko Hori, Shinji Takei
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Abstract
Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.
Claims6
A method for manufacturing semiconductor devices, comprising:
- a step of mounting a semiconductor chip on a lead frame, inserting said lead frame between facing flat surfaces of a cope and a drag constructing a mold, and forming a cavity by use of the flat surfaces of said mold, and frame portions, tie bars and outer leads of said lead frame;
- a step of injecting mold resin into said cavity and curing the same to form a package of mold resin;
- and
- a step of taking out said lead frame from said mold, cutting off peripheral portions of the resin mold of said lead frame to expose the same in an upper surface, lower surface and side surface of said package, thus forming the outer leads whose surfaces make substantially the same plane as upper, lower and side surfaces of said package.
1 more element
Dependencies are inferred from the claim text.