Process for forming a semiconductor device base array and mounting semiconductor devices thereon

A method of packaging a semiconductor device, said method comprising the steps of:

• a) forming an array of bases using a flexible plastic sheet which is plated with a conducting material to form individual leads on each individual base of the array;
• b) placing the flexible plastic sheet containing the array between a foundation and an anchor;
• c) attaching individual dies of semiconductor devices on each of the bases forming the array;
• d) capping each of the individual bases with a protective cap;
• and
• e) willing the platable plastic sheet from the side opposite the adhesive sheet to separate the individual bases and form separate packaged semiconductor devices.

A method of packaging a semiconductor device, said method comprising the steps of:

• a) molding a plastic blank;
• b) punching the plastic blank to form an array of individual bases;
• c) plating the array with copper
• d) using photoresist techniques to form individual leads from the copper on each individual base of the array;
• e) plating the copper with layers of nickel and gold to further build the individual leads;
• f) placing the plastic blank containing the array between a foundation and an anchor, the foundation providing a rigid platform preventing the plastic blank from flexing;
• g) attaching a semiconductor die to each individual base of the array;
• h) connecting the semiconductor dies to the individual leads of each base using wire bonding;
• i) attaching protective caps over each base;
• j) attaching an adhesive sheet to the protective caps;
• and
• k) milling the plastic blank to separate semiconductor devices.