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US 5,665,473 AGranted
Package for mounting a semiconductor device
AssigneeTokuyama Corporation
InventorsTokio Okoshi, Yuka Kato, Hideki Okoshi, Kenichiro Miyahara, Masakatsu Maeda
Life of this patent
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Abstract
A package for mounting a semiconductor device comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. The modulus of elasticity at 25.degree. C. of the adhesive layer is 10 kg/mm.sup.2 or less.
Claims18
A package for mounting a semiconductor device, comprising
- a base plate, and
- a plurality of conductive layers comprising a power layer, a ground layer and signal layer,
- one of said conductive layers laminated onto said base plate via an adhesive layer,
- the remaining conductive layers laminated together and to said conductive layer laminated onto said base plate via an adhesive layer interposed between adjacent layers,
- wherein the modulus of elasticity at 25.degree. C. of said adhesive layers is 10 Kg/mm.sup.2 or less.
2 more elements
Dependencies are inferred from the claim text.