Method for molding using venting pin

A method for molding comprising the steps of:

• providing a resin compound for molding;
• providing a mold tool having first and second platens which oppose one another, each of the first and second platens comprising a package cavity, a package ring cavity which surrounds the package cavity, a clamping area next to the package cavity, and a clamping relief cavity next to the clamping area, said clamping area and said clamping relief area being located between the package cavity and the package ring cavity, and wherein at least one of the first and second platens comprises:
• a venting hole extending from the clamping relief cavity, the venting hole having a first diameter and a first portion;
• and
• a venting pin slidably fit within the venting hole and having at least one flat formed thereon, wherein the at least one flat has a depth from a circumference of the venting pin which creates a gap between the venting pin and the venting hole, and wherein the gap is sufficiently small to prevent seepage of the resin compound into the venting hole;
• providing a lead frame having a semiconductor element coupled thereto;
• bringing the first and second platens together such that the package cavity, the clamping area, the clamping relief cavity, and the package ring cavity of the first platen are aligned with the package cavity, the clamping area, the clamping relief cavity, and the package ring cavity, respectively, of the second platen, such that the lead frame is positioned between the first and second platens, and such that the semiconductor element is contained within the package cavity of each of the first and second platens and portions of the lead frame extend into the package cavity and the package ring cavity;
• retracting the venting pin into the venting hole, wherein upon retracting the gap is created between the at least one flat of the venting pin and the venting hole and the at least one flat extends beyond the first portion of the venting hole;
• and
• introducing the resin compound into the package cavity of each of the first and second platens to encapsulate the semiconductor element, thereby forcing air from the package cavity to the clamping relief cavity and through the gap created between the at least one flat of the venting pin and the venting hole;
• wherein the step of retracting is performed before the step of introducing the resin compound.