Polishing pad, polishing apparatus and polishing method
AssigneeKabushiki Kaisha Toshiba
InventorsRempei Nakata, Hisashi Kaneko, Nobuo Hayasaka, Takeshi Nishioka, Yoshikuni Tateyama, Yutaka Nakano, Yasutaka Sasaki
Life of this patent
Estimating the term…
Abstract
A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag.
Claims30
A polishing pad, comprising at least:
- a first layer having a first main surface serving to polish a substrate and a second main surface;
- and
- a second layer arranged on said second main surface of the first layer and having fine bags therein, said fine bags being positionally fixed relative to each other and isolated from each other, said fine bags hermetically containing fluid.
A polishing apparatus, comprising:
- means for holding or pressing a substrate to be polished;
- a base body having fine bags fixed thereto, said fine bags being isolated from each other;
- and
- a polishing pad interposed between said means for holding or pressing said substrate and said base body.
A polishing method, comprising the steps of:
- allowing a substrate to be held on a substrate holding section;
- supplying a polishing agent onto a polishing surface positioned on fine bags fixed to a base body, said fine bags being isolated from each other;
- and
- rotating said base body to permit said substrate holding section to be pressed against the base body so as to polish a surface of the substrate to be polished.
A polishing pad comprising at least:
- a first layer having a first main surface serving to polish a substrate to be polished and a second main surface;
- and
- a second layer positioned to face said second surface of the first layer and having a fluid-retaining section filled with fluid, a number of reinforcing strings being arranged within said fluid-retaining section.
A polishing apparatus, comprising:
- means for holding or pressing a substrate to be polished;
- base body having a fluid-retaining section arranged on an upper surface thereof, a number of reinforcing strings being arranged within said fluid-retaining section;
- and
- a polishing pad interposed between said means for holding or pressing the substrate and said base body.
A polishing method, comprising the steps of:
- allowing a substrate to be held on a substrate holding section;
- supplying a polishing agent onto a polishing surface positioned on a fluid-supporting section formed on a base body, a number of reinforcing strings being arranged within said fluid-supporting section;
- and
- rotating said base body to permit said substrate-holding section to be pressed against the base body so as to polish a surface of the substrate.
A polishing apparatus, comprising:
- means for holding or pressing a substrate to be polished;
- a base body;
- a fluid cushion including a polishing pad interposed between said means for holding or pressing the substrate and said base body, said base body having a supporting frame for supporting said fluid cushion arranged to extend upward from the side surfaces of the base body;
- and
- a dummy pressurizing mechanism for preventing said fluid cushion from being damaged.
Dependencies are inferred from the claim text.