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AssigneeMicron Technology, Inc.
InventorsHugh Stroupe, Sujit Sharan, Gurtej S. Sandhu
Estimating the term…
A wafer polishing apparatus includes: a) a rotatable polishing platen; b) a polishing pad received outwardly of the polishing platen; c) a wafer carrier head, the wafer carrier head being mounted for selective rotation relative to the polishing platen; the wafer carrier head including a wafer carrier apparatus for use in polishing a semiconductor wafer having a particular orientation edge discontinuity shape, the wafer carrier apparatus including, i) a base support mounted to rotate with the carrier head; and ii) a wafer carrier ring separately rotatably received relative to the base support, the wafer carrier ring having an internal periphery which is sized and shaped to receive the particular semiconductor wafer for which the apparatus is adapted, the wafer carrier ring internal periphery including a portion which is sized and shaped to mate with the particular orientation edge discontinuity shape. A polishing process is also disclosed using this and other apparatus.
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
A process of polishing a semiconductor wafer having an orientation edge discontinuity shape, the process comprising the following steps:
Dependencies are inferred from the claim text.