Detector alignment board
AssigneeNorthrop Grumman Corporation
InventorHarlan R. Isaak
Life of this patent
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Abstract
An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and enlarged metallic pads that are attached to the ends of the vias. Preferably, an insulating layer is formed on opposing sides of the board. Openings are delineated in the layer coinciding with the metallic pads, and preferably solder contacts are deposited in the openings. A multi-layer module may be attached to one side of the alignment board using reflow solder processes. Then, arrays of infrared detectors may be attached to the opposing side of the alignment board using a lower-temperature reflow soldering process. The alignment board facilitates the interfacing and assembly of the focal plane of infrared detection systems.
Claims10
An alignment board for interfacing arrays of infrared detectors to a multi-layer integrated circuit module, each layer having a plurality of conductive conduits formed thereon, the alignment board comprising:
- a) a board of an insulating material having first and second opposing sides;
- b) a multiplicity of through-holes in the board extending between the first and second sides;
- c) conductive vias formed in the through-holes, the vias having a first end in electrical communication with an associated detector of one of the detector arrays, and the vias having a second end in electrical communication with an associated conductive conduit;
- d) sealing plugs formed in the conductive vias, the sealing plugs of an insulating material that completely fills the vias;
- and
- e) a multiplicity of first metallic pads attached to the first end of the vias, the first metallic pads sized larger than the first ends of the vias attached thereto.
Dependencies are inferred from the claim text.