Back to results
US 5,658,623 AGranted
Parting compound for the hot forming of encased metal parts and a process for manufacturing the parting compound
AssigneeSulzer Innotec AG
InventorsEmad Batawi, John Antony Peters
Life of this patent
Estimating the term…
Abstract
A parting compound in the form of a monolithic component (3a, 3b) is used in accordance with the invention for the hot forming of encased metal parts (2). This component consists of powder particles strengthened by sintering. The parting compound material is brittle at ambient temperature and at the deforming temperature of the metal parts is plastically deformable or free flowing in a highly viscous manner.
Claims8
A case for the hot forming of a metal part comprising:
- a metal cover plate sized to circumscribe the metal part;
- and
- a separate, monolithic parting compound having a wall thickness of at least about 0.3 mm and being sized to fit between the metal part and the metal cover plate to facilitate removal of the cover plate from the metal part, the parting compound made from powder particles of a material strengthened by sintering, the material being brittle at ambient temperature and plastically deformable or free-flowing in a viscous manner at a deforming temperature of the metal part, the deforming temperature being about 600.degree. C.-1200.degree. C.
A case for the hot forming of a metal part, the case formed by the process comprising:
- forming a metal cover plate size to circumscribe the metal part;
- mixing a powder with fluid to form a slurry;
- solidifying the slurry in a mold to form a separate, monolithic parting compound having a wall thickness of at least about 0.3 mm sized to fit between the metal part and the metal cover plate;
- and
- sintering the parting compound.
2 more elements
Dependencies are inferred from the claim text.