Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• a prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck and mounted wafer being movable with respect to said probe card;
• and
• wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• and
• further including at least one D/A converter in said tester, said at least one converter being mounted behind said performance board and electrically connected thereto.

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• a prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck and mounted wafer being movable with respect to said probe card;
• and
• wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• further including at least one D/A converter in said tester, said at least one converter being mounted behind said performance board and electrically connected thereto;
• and
• wherein said at least one converter is connected to said performance board by a second array of connector pins.

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• a prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck end mounted wafer being movable with respect to said probe card;
• and wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• wherein said prober includes a base and said chuck is attached to a YZ stage assembly, said base travelling in an X direction to dock with said tester;
• and
• wherein said prober includes a vertical wall mounting a sheet of ferromagnetic material, and wherein said YZ stage assembly comprises a stage base, a pattern of permanent magnets in said stage base, air passages and air nozzles in said stage base and wherein said nozzles are adapted to discharge a supply of compressed air to float the stage base on said sheet as a magnetically preloaded air bearing such that said air bearing resists orthogonal and twisting loads on said vertically-mounted chuck.

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck and mounted wafer being movable with respect to said probe card;
• and
• wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• wherein said prober includes a base and said chuck is attached to a YZ stage assembly, said base travelling in an X direction to dock with said tester;
• and
• wherein said YZ stage assembly comprises a YZ stage and a ring carrier including a substage, and wherein said substage is movable in YZ motion to allow fine alignment of said prober to said tester.

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• a prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck and mounted wafer being movable with respect to said probe card;
• and
• wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• wherein said prober includes a base and said chuck is attached to a YZ stage assembly, said base travelling in an X direction to dock with said tester;
• and
• wherein said YZ stage assembly has motion in the Y direction and said YZ stage assembly comprises a YZ stage and a ring carrier including a substage, and wherein said substage is movable in Z motion, and wherein the Y motion of the YZ stage assembly and the Z motion of the substage combine to allow fine alignment of said prober to said tester.

Apparatus for testing semiconductor wafers containing integrated circuits comprising:

• a tester having a vertically oriented performance board fixedly positioned with respect to the tester, said performance board including electrical connectors freely accessible from a vertical surface of the tester;
• a prober including a vertical array of horizontal connector pins adapted to be connected to the electrical connectors of said tester, a vertical probe card mounting a series of probe needles and an adjustable vertically-mounted chuck vertically mounting a semiconductor wafer containing integrated circuits, each of said integrated circuits containing contact pads, said chuck and mounted wafer being movable with respect to said probe card;
• and
• wherein at least one of said tester and said prober are movable along a fixed horizontal path with respect to each other to dock said tester and prober together to electrically connect selected ones of said vertical array of horizontal connector pins to selected ones of said electrical connectors;
• wherein movement of said chuck and mounted wafer makes an electrical contact between said contact pads and said probe needles;
• and
• wherein said prober includes a latching arm and said tester includes a latching keeper, said arm being latchable into said keeper upon docking of said prober and tester.

A method for testing semiconductor wafers containing integrated circuits including contact pads comprising:

• providing a tester having a vertically oriented performance board fixedly positioned with respect to the tester, and said board including electrical connectors;
• providing a prober including a vertical array of horizontal connector pins and a wafer-mounting chuck;
• mounting a semiconductor wafer containing integrated circuits including contact pads on said chuck;
• moving one of the tester and prober toward the other along a fixed horizontal predetermined path;
• docking the tester and prober together to electrically connect said electrical connectors to said array of horizontal connector pins;
• providing a vertical probe card mounting a series of probe needles on the prober;
• and
• further including the step, after the docking step, of moving said chuck and the mounted wafer to make an electrical contact between contact pads on integrated circuit on the wafer and said series of probe needles.