Method of packaging a semiconductor device

A method of manufacturing a semiconductor component comprising:

• providing a substrate;
• providing a first mold plate having a substrate cavity;
• providing a second mold plate having a package cavity;
• disposing the substrate in the substrate cavity to form a gap in the substrate cavity;
• disposing a blocking layer adjacent to a portion of the gap;
• positioning the second mold plate over a portion of the first mold plate, the package cavity overlying a portion of the substrate;
• and
• forcing an encapsulation material into the package cavity wherein the blocking layer keeps the encapsulation material out of the gap.

A method of manufacturing a semiconductor component, the method comprising the steps of:

• providing a lower chase having a substrate cavity, the substrate cavity having a sidewall;
• providing an insert within the substrate cavity, the insert movable within the substrate cavity, a first gap between the insert and the sidewall of the substrate cavity;
• providing a semiconductor substrate;
• manufacturing a semiconductor device in the semiconductor substrate;
• providing an assembly substrate supporting the semiconductor substrate, the assembly substrate supported by the insert, the assembly substrate located in the substrate cavity wherein a second gap exists between the assembly substrate and the sidewall of the substrate cavity, the second gap coupled to the first gap;
• disposing a protective layer over a portion of the lower chase, a portion of the assembly substrate, and a portion of the second gap;
• providing an upper chase overlying the lower chase, the upper chase having a runner and a package cavity, the runner overlying portions of the protective layer and the second gap, the runner coupled to the package cavity, the package cavity overlying the semiconductor substrate;
• injecting a mold compound through the runner and into the package cavity wherein the protective layer prevents the mold compound from entering the first gap;
• and
• removing the assembly substrate and the semiconductor substrate from the substrate cavity.