Method of manufacturing flat wiring body

A method of manufacturing a flat wiring body, comprising the steps of:

• laminating a conductor foil on one surface of a carrier tape through a sticking layer;
• stamping out, without cutting the carrier tape, the laminated conductor foil along cut lines which divide the conductor foil into a wiring pattern part and a conductor remainder part other than the wiring pattern part;
• stamping out, without cutting the carrier tape, the conductor foil along cut lines which divide the conductor remainder part into a first conductor remainder part continuously enclosing the entirety of the wiring part and a second conductor remainder part excluding the first conductor remainder part;
• removing the first conductor remainder part out of the conductor foil by peeling the first conductor remainder part from the carrier tape, leaving the second conductor remainder part on the carrier tape, after the step of stamping out the conductor foil along the cut lines which divide the conductor remainder part into the first and second conductor remainder parts;
• forming a laminate by laminating an insulating tape having an adhesive layer on the carrier tape from which the first conductor remainder part is removed so that the adhesive layer is in contact with the wiring pattern part;
• and
• transferring the wiring pattern part of the laminate to the insulating tape,
• wherein in the step of transferring the wiring pattern part, only the wiring pattern part is adhered to the insulating tape by applying heat and pressure to only a region corresponding to the wiring pattern part in the laminate.