Coupled, flux transformer heat pipes

A heat pipe device including:

• a plurality of heat pipe stages, each of said heat pipe stages including:
• a heat input end including an evaporator,
• a hollow adiabatic section, and an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant,
• said plurality of heat pipe stages being connected in cascade with the condenser of the preceding stage secured integrally and directly by a joint to the corresponding evaporator of the succeeding stage, said joint providing for maximum heat transfer, and
• each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof, with a first stage of said stages of said heat pipe including at its said evaporator a heat input end for said heat pipe device and the last of said stages of said heat pipe having an output end including the condenser of said last heat pipe stage.

A semiconductor substrate carrying a plurality of semiconductor chips and a package for cooling said semiconductor chips, said package including cooling apparatus including a heat pipe device with a heat input end including an evaporator, and a hollow adiabatic section, an output end including a condenser, with said evaporator and said condenser joined by said hollow adiabatic section containing a wicking material and a coolant,

• said heat pipe including a plurality of heat pipe stages connected in cascade with the condenser of the preceding stage secured directly by a joint to the corresponding evaporator of the succeeding stage each of said stages having a larger inner cross-sectional area at said condenser thereof than at said evaporator thereof,
• said individual heat pipes being interconnected by sleeves of variable lengths screwed one into the other to provide joints, wherein said device is connected to cool chips mounted on a substrate, said substrate being mounted in a box, and said heat pipe is composed of flexible material connected to said box containing said substrate as a heat sink,
• the evaporator section of one of said heat pipe stages is made out of silicon which is sealed to the proximal end of the heat pipe which in turn is soldered to said chip,
• said joints providing for maximum heat transfer,
• whereby said heat pipe and said box comprise an integral cooling structure for said semiconductor chip.