Method and compositions that render materials RF responsive

A material structure comprising:

• a first substrate layer with inner and outer surfaces and a dielectric loss approximately less than 0.2 at approximately 27-60 MHz over a temperature range of ambient to approximately 310.degree. C.;
• a second substrate layer with inner and outer surfaces and a dielectric loss approximately less than 0.2 at approximately 27-60 MHz over a temperature range of ambient to approximately 310.degree. C., the second substrate layer inner surface being positioned adjacent to the first substrate layer inner surface to define an interface, the first and second substrate layers each being selected from the group consisting of polyesters, thermoplastic block copolymers, polyethers, and polyacetals;
• a first deposit within a portion of the interface defining an RF sealable area, the first deposit has a dielectric loss approximately greater than 0.2 at approximately 27-60 MHz over a temperature range of ambient to approximately 310.degree. C., the first deposit being a polymer generated from or containing a member selected from the group consisting of vinyl ketone, vinylene carbonate, vinyl carbonate, imide, carbonate, imide sulfone, sulfoxide, phosphate, phosphonate, urethane, lactone, lactam, phenoxy, thermoplastic block copolymer and combinations thereof;
• and,
• a seal within said RF sealable area created by means for applying electromagnetic radiation having a frequency within a range of 27-60 MHz to the RF sealable area attaching the first substrate layer to the second substrate layer along the first deposit.