Lead-free conductive paste

Abstract

A nontoxic lead-free conductive paste comprising (a) a lead-free glass frit having a crystallization temperature of 700.degree.-870.degree. C. and consisting essentially of, by weight %, 20-38% of SiO.sub.2, 5.5-13.5% of B.sub.2 O.sub.3, 8-15.5% of Al.sub.2 O.sub.3, 4-19% of CaO, 20-29% of ZnO, 0-6% of ZrO.sub.2, 4-16% of TiO.sub.2 and 0.1-3.8% of MoO.sub.3 ; (b) finely divided particles of electrically conductive material; (c) at least one inorganic additive selected from the group consisting of bismuth oxide, zinc oxide-containing containing oxide material, manganese oxide, copper oxide and molybdenum oxide; and (d) an organic medium. The nontoxic conductive paste is free from environmental and health problems and results in conductors having excellent solderability, solder leach resistance, adhesion strength and electrical properties, both on ceramic substrates such as alumina or on dielectric bodies.

Dependencies are inferred from the claim text.